不同循环温度下SnAgCu／Cu界面金属间化合物生长行为  

Growth behaviors of intermetallic compounds on SnAgCu/Cu interface at different cyclic temperature

作　　者：樊艳丽[1] 王怀建[1] 黄晓英[1] 

机构地区：[1]重庆工业职业技术学院车辆工程学院,401120

出　　处：《焊接》2015年第11期49-52,共4页Welding & Joining

摘　　要：基于自制的多场耦合装置，研究了Sn-3．0Ag-0．5Cu／Cu钎焊接头在不同温度循环条件下界面金属间化合物（IMC）的生长厚度及形貌变化。结果表明，相同的试验条件下，在200个循环周期内，钎焊接头界面化合物生长较快。随着热循环周期的增加，界面金属间化合物的平均厚度逐渐加厚，同时800循环周期后界面金属间化合物（IMC）的彤貌由扇贝状转变为层状。随着循环温度的升高，界面化合物的生长速率加快，生长指数变大，达到0．63。Based on the home- made multiphase field device,an investigation was carried on growth behavior and the thickness of intermetallic compounds(IMC) at the interface between Sn-3.0Ag-0.5Cu lead-free solder and Cu substrate.The results show that under the same experimental conditions,the IMCs grow faster in 200 thermal cycles,the more the thermal cycles,the faster the IMCs grow at the same aging temperature.The morphology of IMCs change from the scallop shape to the layered shape when the thermal cycles are 800.With the increase of cyclic temperature,the IMCs grow faster and the growth index is larger to reach up to 0.63.

关 键 词：多场耦合 显微组织 界面IMC 循环温度 

分 类 号：TG455[金属学及工艺—焊接]