热处理对Cu/Al-3.25Si合金冷压焊接复合带界面组织与性能的影响  

Effect of heat treatment on interface microstructure and property of Cu/Al-3.25Si cold-press welded joint

作　　者：王泽宇[1] 赵莹莹[1] 常东旭[1] 王平[1] 

机构地区：[1]东北大学材料电磁过程研究教育部重点实验室,沈阳110819

出　　处：《焊接学报》2015年第11期81-84,117,共4页Transactions of The China Welding Institution

基　　金：国家自然科学基金资助项目(51174058);东北大学大学生创新计划资助项目(20140215)

摘　　要：利用金相显微镜、扫描电镜、万能材料实验机等,研究了Cu/Al-3.25Si合金冷压焊接复合带热处理工艺,讨论了界面层厚度、界面结合强度、铜铝金属间化合物生成规律等问题.结果表明,随着热处理温度的升高和保温时间的增加,扩散层厚度的增长呈现先快再慢的趋势,动力学曲线时间指数在0.5-1之间;界面的结合强度随着热处理温度和保温时间的增加呈先升高后降低的趋势;界面金属间化合物有Cu_9Al_4,Cu Al,CuAl_2等;最佳热处理温度宜控制在200-300℃,保温时间在2 h以内.The influence of heat treatment process on the interface thickness,interfacial bonding strength and the compounds change of Cu / Al-3. 25 Si cold-press joining was investigated by measuring the mechanical properties and observing microstructure. The results showed that the inter-layer thickness was firstly growing quickly with the increase of heat treatment temperature and holding time,and then it was growing slowly. The kinetics of the diffusion layer growth hasa index of 0. 5- 1. The interfacial shear strength is also growing quickly with the increase of heat treatment temperature and preservation time and then slowly. The intermetallic compounds is Cu_9Al_4,CuA l,CuAl_2 from the copper side to the aluminum side under the optimum condition of 300 ℃ × 2 h.

关 键 词：冷轧复合带 Cu/Al-3.25Si合金 热处理 界面 化合物 

分 类 号：TG495[金属学及工艺—焊接]