硅酸钠对胶结膏体充填材料凝结性能的影响机制  

Influence Mechanism of Sodium Silicate on the Setting Performance of Cemented Paste Backfill Material

作　　者：焦华喆[1] 吴爱祥[2] 容苡 刘晓辉[2] 

机构地区：[1]河南理工大学土木工程学院,焦作454000 [2]北京科技大学土木与环境工程学院,北京100083 [3]云南会泽铅锌矿,曲靖654200

出　　处：《硅酸盐通报》2015年第11期3303-3307,3314,共6页Bulletin of the Chinese Ceramic Society

基　　金：国家"十二五"科技支撑计划(2012BAB08B02);国家自然科学基金(51574013;51374034);河南理工大学博士基金(B2015-60);河南省高校科技创新团队支持计划(15IRTSTHN029)

摘　　要：膏体充填材料的缓凝事故严重影响资源的有效回采。本文针对会泽矿全尾砂-水淬渣胶结膏体充填物料缓凝问题,开展多因素均匀实验,研究材料凝固、强度性能的影响规律及权重。回归分析表明,随着水玻璃单耗的增加（水泥重量的2%~12%）,膏体凝结时间减少。对于凝结时间影响权重最大的因素为灰砂比（18.6%）,其次为水玻璃单耗（5.1%）。水玻璃单耗的增加能够促进膏体强度的提高,但影响权重较小（仅为4.6%）,决定充填体强度的因素仍为灰砂比（57.1%）。当膏体配比为全尾砂∶水淬渣∶水泥=7∶1∶1,浓度为78%~80%,水玻璃单耗3%~4%时,膏体凝结时间为8.2~12.5 h,28 d强度为2.33~2.76 MPa,符合膏体充填工艺的要求。Paste backfill material retarding accidents seriously affect the resources effective mining. The influence law and weight of multi factors on the setting and strength performance of the tailings-slag cemented paste backfill material was studied by the uniform experiment, which focus on the retarding problem of the paste backfill material in Huize Mine. The regression analysis shows that with the increasing of sodium silicate consumption （ of cement weight 2% -12% ）, the paste setting time reducing. The greatest weight influence factor for the setting time is the cement-sand ratio with the cement-sand ratio of 18.6%, follow by the factor of sodium silicate consumption with the weight of 5. 1%. Increasing sodium silicate consumption can promote the paste strength in a certain range, the influence weight is only 4.6%. The determinant of the backfill body strength is cement-sand ratio （57.1%）. When the ratio of cemented paste backfill material is tailings： water quenched slag： cement = 7： 1： 1, the concentration is 78% -80%, the consumption of sodium silicate 3% -4%, the paste setting time is 8.2- 12.5 h, the uniaxial compressive strength at 28 d can reach 2.33-2.76 MPa, the UCS value full fill paste filling process requirements.

关 键 词：硅酸钠 胶结膏体 缓凝事故 影响机制 

分 类 号：TU528[建筑科学—建筑技术科学]