VMQ/环氧/BN增强加成型导热硅胶的研究  

Study on VMQ/epoxy/BN enhancing addition curable silicone adhesive with thermal conductivity

作　　者：黄月文[1,2] 王斌[1,3] 郑周[1,2] 张伟[1,3] 

机构地区：[1]中科院广州化学有限公司,广东广州510650 [2]广州市电子信息聚合物工程中心,广东广州510650 [3]广东省电子有机聚合物材料重点实验室,广东广州510650

出　　处：《粘接》2015年第12期60-63,41,共5页Adhesion

基　　金：广州市科技计划(2014J4100226)

摘　　要：将烯丙基缩水甘油醚、纳米级乙烯基甲基MQ硅树脂(VMQ)、硅烷偶联剂KH560、微米级导热填料BN混杂在端乙烯基甲基硅油中,通过加入交联剂(含氢甲基硅油)、抑制剂(乙炔基环己醇)及Karstedt催化剂制备了室温流动性好、操作时间长的液体导热硅胶,探讨了硅胶的交联固化增强机理。结果表明,通过VMQ改性的硅胶,拉伸强度和粘接强度显著提高,再经环氧改性后粘接强度可进一步提高到1.2 MPa。随着BN掺量的增加,热导率大幅提升。当乙烯基硅油质量份为100、VMQ为90、烯丙基缩水甘油醚为2、BN为60时,热固化形成的硅橡胶热导率可达到1.6 W/(m·K),质量损失10%时温度可达631K。A novel silicone adhesive with good fluidity and long operation time at room temperature was prepared by mixing the terminated-vinyl methyl silicone oil, allyl glycidyl ether, nano-scale vinyl methyl MQ silicone resin （VMQ）, KH560 silane coupling agent, micro-scale thermal-conductive BN particles as the filler, methyl hydrogen polysiloxane fluid as the crossing-linking agent, inhibitor ethynylcyclohexanol and catalyst Karstedt. The heat curing and enhancing mechanism were investigated. The tensile and adhesion strength of the silicone adhesive were obviously improved with the increase of VMQ, and the adhesion strength was distinctively reached 1.2 MPa after future modification with allyl glycidyl ether. The heat cured adhesive had 1.6 w/（m K） of heat conductivity and 631 K of decomposition temperature in 10% weight loss,when the amount of vinyl methyl silicone oil was 100 parts, VMQ was 90 parts, allyl glycidyl ether was 2 parts and BN was 60 parts.

关 键 词：乙烯基甲基MQ硅树脂 硅氢加成 高导热硅胶 耐高温 

分 类 号：TQ436.6[化学工程]