有机胶体黏附力作用下的钎焊工艺  

Brazing Process Assisted by Adhesion from Organic Colloid

作　　者：赵磊[1] 李晓红[1] 侯金保[1] 孙强[1] 

机构地区：[1]北京航空制造工程研究所,北京100024

出　　处：《材料工程》2015年第12期63-68,共6页Journal of Materials Engineering

摘　　要：利用有机胶体的黏附作用力改善待连接表面的界面张力,可为实现异种材料间的钎焊连接提供有利条件。以环氧树脂为黏性胶体,TiH_2粉为活性元素源,AgCu共晶合金箔为钎料,将TiH2与环氧树脂混合后涂敷在SiO_2f/SiO_2复合材料表面,并在此表面进行钎料润湿实验。结果表明:胶体黏附力对钎料的润湿铺展具有促进作用。将此工艺用于钎焊连接,可实现SiO_2f/SiO_2复合材料、Cf/SiC复合材料以及Al_2O_3陶瓷与Invar合金的冶金致密连接。Adhesion force of organic colloidal can improve the interfacial tension of the material surfaces to be connected and thus provide favorable conditions for brazing between dissimilar materials.The epoxy resin was chosen as viscous colloid,TiH_2 powder as the source of active elements,and AgCu eutectic alloy foil as filler metal.The mixture of TiH2 and epoxy resin in a certain percentage was coated on the surface of SiO_2f/SiO_2 composites and heated to evaluate the wetting ability.The results of wetting experiment on the coated surface show that colloid adhesion improves the wetting and spreading of brazing filler materials.The application of this novel method in brazing can realize sound joints between Invar alloy and SiO_2f/SiO_2 composites,Cf/SiC composites or Al_2O_3 ceramic.

关 键 词：胶体 钎焊 复合材料 

分 类 号：TG454[金属学及工艺—焊接]