超声波清洗在电镀前处理中的应用及选型  

The Applications of Ultrasonic Cleaning in Plating Pre-treatment

作　　者：郝鹏飞[1] 杜斌[1] 

机构地区：[1]中国电子科技集团公司第二研究所,山西太原030024

出　　处：《电子工业专用设备》2015年第11期40-42,46,共4页Equipment for Electronic Products Manufacturing

摘　　要：常规电镀前处理工艺中加入超声波清洗工艺,利用超声波的空化作用对工件特别是外形结构复杂或有孔洞的工件进行清洗,不仅能缩短清洗时间而且提高清洗质量;主要介绍了超声波清洗的原理、结构特点、电镀前处理工艺中的典型超声清洗工艺等,并对超声波参数选择以及影响超声波清洗效果因素等进行了阐述。Adding ultrasonic cleaning process in conventional plating pre-treatment process ,and using ultrasonic cavitation for cleaning the workpiece that have complex shape structure or have holes can not only shorten the cleaning time but also improve the quality of cleaning. This article is to introduce the principle of ultrasonic cleaning,structural characteristics, typical ultrasonic cleaning process in plating pre-treatment process and so on. Also expound the parameters of ultrasonic and the factors of affecting ultrasonic cleaning effect.

关 键 词：超声波 超声波清洗 电镀前处理 

分 类 号：TN705[电子电信—电路与系统]