化学镀非晶态Ni-P及Ni-Sn-P镀层在弱酸性介质中耐蚀性研究  

Study of the Corrosion Resistance of Eletroless Amorphous Ni-P and Ni-Sn-P Coatings in Weak Acidic Medium

作　　者：周海晖[1,2] 张承平[1,2] 方晨旭 冯兵[3] 徐松[3] 廖作为 旷亚非[1,2] 

机构地区：[1]湖南大学化学生物传感与计量学国家重点实验室,湖南长沙410082 [2]湖南大学化学化工学院,湖南长沙410082 [3]国网湖南省电力公司电力科学研究院,湖南长沙410007

出　　处：《湖南大学学报（自然科学版）》2015年第12期59-63,共5页Journal of Hunan University:Natural Sciences

基　　金：国家自然科学基金资助项目(J1210040);国家电网公司总部科技项目(KG12K16004)~~

摘　　要：以紫铜为基体,采用化学镀制备了非晶态Ni-P,Ni-Sn-P镀层.采用X射线衍射(XRD)、扫描电子显微镜(SEM)和X射线能谱(EDS)等对镀层的结构、微观形貌及元素组成进行分析.通过Tafel极化曲线、电化学阻抗谱(EIS)、开路电位监测及室内加速腐蚀试验,研究两种镀层在pH=5.5,w_(NaCl)=3.5%,以及pH=5.5,wS=20%的土壤介质中的耐蚀性能.结果表明,化学镀非晶态Ni-P及Ni-Sn-P镀层的自腐蚀电流密度是裸铜的4.5%和1.2%,两种镀层在酸性腐蚀介质中具有比金属铜更好的耐蚀性,并且化学镀Ni-Sn-P镀层耐蚀性优于Ni-P镀层.两种镀层的自腐蚀电位均负于铜.Amorphous Ni-P and Ni-Sn-P coatings were prepared on pure copper substrates by electroless plating. The structure, surface morphology and composition of the as-plated coatings were characterized by X-ray diffraction （XRD）, scanning electron microscopy （SEM） and energy-dispersive analysis （EDS）. The corrosion resistance behaviors of the as-plated Ni-P and Ni-Sn-P coatings were investigated by Tafel polarization, electrochemical impedance spectroscopy （EIS）, open circuit potential and accelerating corrosion indoors in ωNaCl =3. 5% solution at pH 5.5 and in soil with a water content of ωs=20% at pH 5. 5. The results indicate that electroless amorphous Ni-P and Ni-Sn-p plating of the corrosion current density is 4.5 % and 1.2 % of the bare copper and the two coatings offer better corrosion resistance than copper in weak acidic corrosive medium, while Ni-Sn-P coating exhibits the best corrosion resistance. Besides, thetwo coatings have a negative shift of self-corrosion potential when compared with Cu substrate, showing a good application prospect as anodic protective coatings for Cu ground wires in acidic or weak acidic soil medium.

关 键 词：化学镀 铜接地线 弱酸性 土壤介质 耐蚀性 

分 类 号：O69[理学—化学]