尘土污染对电路板表面湿度的影响  

Effects of Dust Contamination on Surface Relative Humidity of Printed Circuit Board

作　　者：周怡琳[1] 韦霞霞 

机构地区：[1]北京邮电大学自动化学院,北京100876

出　　处：《电工技术学报》2015年第23期163-168,共6页Transactions of China Electrotechnical Society

摘　　要：以尘土颗粒中具有代表性的可溶性盐和不可溶颗粒覆盖标准梳状电路板进行温湿偏置实验,通过线间绝缘电阻监测,研究可溶性盐颗粒的成分及溶解度对电路板表面临界相对湿度的影响以及不可溶颗粒在毛细管作用下改变电路板表面水分脱附从而影响其表面湿度的机理,并进一步探讨了颗粒污染造成电路板表面电化学迁移的失效机理。In this paper,to study the effect of soluble and insoluble particles of typical dust on the relative humidity on PCB surface, the comb pattern PCB covered by particles is adopted as test samples under temperature humidity bias（ THB） conditions. The surface insulation resistance between circuits on PCB is monitored. The effect of compositions and solubility of soluble particles on the critical relative humidity is investigated. The reasons of the insoluble particles, under the action of capillary, changing the desorption of water from PCB surface and keeping high humidity on PCB surface for longer time are researched. The electrochemical migration mechanism of PCB caused by dust contamination is also discussed.

关 键 词：尘土颗粒 电路板 盐的溶解性 临界相对湿度 温湿偏置实验 

分 类 号：TM207[一般工业技术—材料科学与工程]