酚酞基聚芳醚酮改性环氧树脂结构胶膜的研制  

Study on preparing epoxy resin structure adhesive film modified by phenolphthalein polyaryletherketone

作　　者：冯浩[1] 曲春艳[1] 王德志[1] 毛勇[1] 王海民[1] 

机构地区：[1]黑龙江省科学院石油化学研究院,黑龙江哈尔滨150040

出　　处：《中国胶粘剂》2015年第12期27-30,共4页China Adhesives

基　　金：黑龙江省科学院青年创新基金重点项目

摘　　要：以酚酞基聚芳醚酮（PEK-C）为主增韧剂、环氧基丁腈橡胶为辅助增韧剂、芳香胺为固化剂、E-51（双酚A型环氧树脂）为主体树脂、F-44（酚醛型环氧树脂）和AG-80（四官能团环氧树脂）为改性树脂,制备出一种改性EP结构胶膜。研究结果表明：当w（PEK-C）=45%~50%、w（环氧基丁腈橡胶）=12%（均相对于EP结构胶膜质量而言）时,EP结构胶膜的玻璃化转变温度（Tg）为179.8℃、滚筒剥离强度为123.60 N·mm/mm,并且其粘接性能、耐热性和耐久性俱佳。With phenolphthalein polyaryletherketone （PEK-C） as main flexibilizer, epoxy-chemigum as auxiliary flexibilizer, aromatic amine as curing agent, E-51[bisphenol A type EP （epoxy resin）] as matrix resin, F-44（phenolic-EP） and AG-80（four functional groups EP） as modified resins, a modified EP structure adhesivefilm was prepared. The research results showed that the glass transition temperature （Tg） and roller peeling strength were 179.8℃ and 123.60 N. mm/mm respectively for the EP structure adhesive film, and its bonding properties, heat resistance and durability were all good when mass fractions of PEK-C and epoxy-chemigum were 45%-50% and 12% respectively in EP structure adhesive film.

关 键 词：酚酞基聚芳醚酮 环氧树脂 结构胶 改性 耐热性 耐久性 

分 类 号：TQ436.2[化学工程] TQ433.437