四酚基乙烷环氧树脂的固化性能  

Curing Properties of Tetraphenol Ethane Epoxy Resin

作　　者：闫宁[1] 季娜妮 沈宗祎 雷毅[1] 

机构地区：[1]四川大学高分子科学与工程学院,高分子材料工程国家重点实验室,成都610065

出　　处：《宇航材料工艺》2015年第2期48-51,共4页Aerospace Materials & Technology

摘　　要：研究了甲基四氢邻苯二甲酸酐(Me THPA)和4,4-二氨基二苯基砜(DDS)两种固化剂对1,1,2,2,-四(对羟基苯基)乙烷四缩水甘油醚环氧树脂(TGE)固化反应及固化性能的影响。通过DSC研究了树脂的固化行为,结果表明Me THPA体系与DDS体系的固化反应活化能分别为65.8和68.4 k J/mol;同时通过DMA、TGA以及万能材料试验机等方法对树脂的热力学和力学性能等进行研究。Me THPA体系的Tg为188℃,初始热分解温度为219.9℃,拉伸强度为33 MPa,弯曲强度为48 MPa。而DDS体系的Tg为203℃,初始分解温度为292.3℃,拉伸与弯曲强度分别为61和93 MPa。This paper focus on studying the effects of two different curing agents （tetrahydromeythyl-1,3-iso- benzofurandione MeTHPA, and 4,4-diaminodiphenyl sulfone DDS） on curing reaction and curing properties of 1,1,2, 2-tetrakis（4-hydroxyphenyl） ethane tetraglycidyl ether（TGE）. The curing behavior of the TGE was characterized by scanning calorimetry analysis （DSC）. The results demonstrated that curing reaction activating energy of two epoxy res- in/hardener systems were 65.8 kJ/mol and 68.4 kJ/mol, respectively. The curing resin thermal properties and mechan- ical properties were investigated by dynamic mechanical analysis （DMA）, thermal gravity analysis （TGA） and universal testing machine, respecticaly. The glass transition temperature（ Tg ） of MeTHPA system is 188℃. Tensile and flexural strength is 33 MPa and 48 MPa. The Ts of DDS system is 203℃. Tensile and flexural strength is 61 MPa and 93 MPa.

关 键 词：四酚基乙烷环氧树脂 固化剂 热性能 力学性能 

分 类 号：TQ322[化学工程—合成树脂塑料工业]