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作 者:王俊伟[1] 夏伟[1] 郭虎[1] 王涛[1] 谢信湘 何建平[1]
机构地区:[1]南京航空航天大学材料科学与技术学院,江苏南京210016
出 处:《电子元件与材料》2016年第1期33-36,共4页Electronic Components And Materials
基 金:江苏高校优势学科建设工程资助项目
摘 要:通过化学镀镍对聚对苯二甲酸乙二醇酯(PET)基体表面氧化铟锡(ITO)薄膜进行金属化处理从而提高其导电性能。该化学镀镍工艺不同于传统工艺,无需敏化,直接经过活化还原后实现在柔性ITO薄膜表面选择性化学镀镍。采用扫描电子显微镜(SEM)、结合力测试和导电性测试对镀层形貌和性能进行表征。结果表明,ITO表面镀镍层均匀致密、附着力好,PET基体无镍层覆盖,具有高度的选择性,且极大提高了柔性ITO薄膜的导电性和疏水性能。Metallization on the indium tin oxide (frO) film of the polyethylene terephthalate (PET) matrix was processed by electroless nickel plating to improve the electrical conductivity. Compared with traditional sensitizing methods, a novel method without sensitizing for selective electroless nickel plating on the surface of flexible ITO film was proposed through activation-reduction. Microstructure and property of the Ni-P plating were studied by scanning electron microscopy(SEM), adhesion strength and electrical conductivity. Results show that the nickel particles are plated uniformly on the 1TO film with strong adhesion, while nickel particles do not grow on the PET matrix, indicating the high selectivity of the method. In addition, the electrical conductivity and hydrophobicity of the flexible ITO film are also remarkably improved.
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