金属互连线电迁移过程中的高温蠕变行为研究  

Research on high temperature creep behavior of metal interconnects during electromigration

作　　者：崔海坡[1] 邓登[1] 

机构地区：[1]上海理工大学教育部微创医疗器械工程中心,上海200093

出　　处：《电子元件与材料》2016年第1期37-39,共3页Electronic Components And Materials

基　　金：上海市自然科学基金资助项目(No.15ZR1428200)

摘　　要：基于ABAQUS有限元分析软件,对金属互连线的蠕变行为进行了研究,获取了高温下的蠕变应力分布云图,并分析了不同温度、不同升温速率等参数对铝硅合金互连线蠕变行为的影响规律。结果表明:在温度载荷作用下,铝硅合金互连线的蠕变应力在互连线狭窄部位即尺寸突变的部位,呈现明显的应力集中现象;随着温度载荷的升高,互连线内部的蠕变应力值逐渐增大,且二者之间的关系近似为一条直线;在其他条件均相同的情况下,升温速率越快,互连线内部应力达到最大值所用的时间就越短,导致互连线承受高应力值的时间就越长,从而会加速部件的失效。Creep behavior of metal interconnects was researched based on the ABAQUS soft-ware, the creep stress distributions of interconnects under high temperature were obtained. The influence regularities of different temperature and heating rate on the creep behavior of Al-Si alloy interconnects were analyzed. The results indicate that, under the temperature loading, creep stress concentration areas of Al-Si alloy interconnects are located at the narrow parts. Creep stress rises with the increase of temperature, and the relationship of them is nearly a straight line. Under the same conditions, the heating rate is higher, the time.of creep stress reaching the maximum value is shorter, and the time of interconnects bearing high stress is longer, which results in the accelerated failure of components.

关 键 词：蠕变 互连线 电迁移 影响规律 有限元分析 失效 

分 类 号：TG457[金属学及工艺—焊接]