基片减薄结构的薄膜环行器的仿真设计  

Simulation design of thin film circulator based on substrate thinning structure

作　　者：汪林[1] 郑梁[1] 郑辉[2] 崔佳冬[1] 秦会斌[1] 

机构地区：[1]杭州电子科技大学新型电子器件与应用研究所,浙江杭州310018 [2]电子科技大学薄膜与集成器件国家重点实验室,四川成都610054

出　　处：《电子元件与材料》2016年第1期44-46,67,共4页Electronic Components And Materials

基　　金：国家自然科学基金资助项目(No.51302056);浙江省公益性技术应用研究计划资助项目(No.2013C31064)

摘　　要：利用三维电磁仿真软件HFSS研究了基片减薄结构对微带薄膜环行器性能的影响。提出了一种减薄非磁性介质基片的结构:首先将基片进行减薄处理,再与具有孔洞的硅基片结合,组合成复合基片。研究了复合基片结构对薄膜环行器S参数的影响。研究结果显示这种基片处理过的环行器能显著改善环行器的性能,尤其在器件的工作带宽方面,从原有的435 MHz提高到745 MHz。这为制备出宽带薄膜环行器取代块材环行器,为器件的小型化、轻量化、集成化提供一定的参考。3D electromagnetic simulation software HFSS was used to study the effect of substrate thinning structure on the performance of microstrip thin film circulator. A structure of thinning non magnetic dielectric composite substrate was put forward. First, the substrate of thin-film circulator was thinned, then combined with the Si substrate having a hole, then assembled into composite substrate. After that, the influences of composite substrate structure on the S parameters of thin film circulator were studied. The results of the study show that the composite substrate can significantly improve the performance of the circulator. Especially the working bandwidth of the circulator is raised from the original 435 MHz to 745 MHz. The film circulator can replace bulk circulator, that supplies references for miniaturization, lightweight and integration of the microwave devices.

关 键 词：薄膜环行器 基片减薄结构 复合基片 薄膜厚度 带宽 HFSS 

分 类 号：TN432[电子电信—微电子学与固体电子学]