冷压烧结-热挤压复合工艺制备亚微米SiC_P/Cu复合材料的力学及耐磨性能  

Mechanical and Wear Resistance Properties of Submicro-meter SiC_P/Cu Composite Prepared by Cold Press Sintering-Hot Extrusion Composite Technology

作　　者：王保卫[1] 郑雷[2] 何鹏[3] 戴峰泽[4] 

机构地区：[1]鲁东大学交通学院,山东烟台264025 [2]盐城工学院机械工程学院,江苏盐城224051 [3]江苏大学机电总厂,江苏镇江212013 [4]江苏大学机械工程学院,江苏镇江212013

出　　处：《热加工工艺》2015年第24期123-126,共4页Hot Working Technology

摘　　要：采用冷压烧结-热挤压复合加工工艺制备了亚微米SiC颗粒增强铜基复合材料,研究了SiCP/Cu复合材料的微观组织、显微硬度、力学性能、导电性能和耐磨性能。结果表明采用本方法可以获得组织致密的亚微米SiC颗粒增强Cu基复合材料。复合材料5vol%亚微米SiCP/Cu复合材料展现出了优良的耐磨性能,是锡青铜的1.7~8倍。在复合材料磨损表面形成了高硬、SiC颗粒弥散均匀的耐磨损层。The microstructure, microhardness, mechanical properties, electric conductivity and wear resistance of SiCp/Cu composite prepared by cold press sintering-hot extrusion composite technology were studied. The results show that sub micron-meter SiC particle reinforced Cu matrix composite can be obtained by above methods. 5vo1% SiCv/Cu composite shows good wear performance, which is 1.7-8 times higher than that of tin bronze. A kind of wearing layer with high hardness and SiC dispersion distribution forms on the composite surface

关 键 词：SiCP/Cu基复合材料 亚微米SiCP 热挤压 

分 类 号：TB331[一般工业技术—材料科学与工程] TG115.211[金属学及工艺—物理冶金]