Cu/Al固-液复合界面演化CLSM原位观察分析  

In-situ Observation on Evolution of Cu/Al Bonding Interface in Solid-liquid Bonding by CLSM

作　　者：黄华贵[1] 叶丽芬[1] 刘文文[1] 杜凤山[1] 

机构地区：[1]燕山大学国家冷轧板带装备及工艺技术工程研究中心,河北秦皇岛066004

出　　处：《热加工工艺》2015年第24期127-130,共4页Hot Working Technology

基　　金：国家自然科学基金资助项目(51474189;51374184);河北省自然科学基金资助项目(E2013203377)

摘　　要：为研究Cu/Al固-液复合界面的微观形貌及其动态演化规律,利用共聚焦激光扫描高温显微镜(CLSM)对Cu/Al扩散偶在快速加热至Al液相温度610℃及其保温过程中的固-液复合界面进行了原位观察。并结合复合界面扫描电镜和X射线能谱仪分析结果,探讨了CLSM下界面图像视觉变化与连接界面反应扩散迁移的对应关系,以及CLSM原位观察的可行性。结果表明,高温反应扩散和局部熔合是Cu/Al固-液复合界面结合的主要机制,复合层主要为Al_2Cu。且在无压力作用下,界面夹杂物和氧化层物会严重削弱界面的结合效果。In order to research the microstructure and dynamic evolution law of Cu/Al bonding interface in solid-liquid bonding process, the in-situ observation research was carried out by heating a Cu/A1 couple to reach the liquid Al phase temperature of 610℃ and holding temperature before cooling down on the platform of confocal laser scanning high-temperature microscope（CLSM）. Combining with SEM and EDS analysis results, the correlation between the change of visual sense and the migration of bonding interface caused by reaction diffusion was discussed, and the feasibility of in-situ observation with CLSM was also discussed. The results show that reaction diffusion and local fusion are the main mechanisms of Cu/Al solid-liquid bonding. The composite layer is mostly composed of Al2Cu. The research shows that the inclusions and oxide at the interface can severely weaken the interface bonding effect under no pressure.

关 键 词：Cu/Al复合材料 固-液复合 反应扩散 共聚焦激光扫描高温显微镜 原位观察 

分 类 号：TG230.2[金属学及工艺—铸造] TB357.5[一般工业技术—材料科学与工程]