PbO-TiO_2-SiO_2-R_xO_y真空玻璃焊料封接性能  

Sealing properties of Pb O-TiO_2-SiO_2-R_xO_y system glass of vacuum glazing

作　　者：缪宏[1] 单翔[1] 刘影[2] 张剑峰[1] 王红军[3] 

机构地区：[1]扬州大学机械工程学院,江苏扬州225127 [2]中国人民解放军理工大学,江苏南京210007 [3]南京工业职业技术学院,江苏南京210046

出　　处：《材料热处理学报》2015年第12期13-18,共6页Transactions of Materials and Heat Treatment

基　　金：国家自然科学基金(51372216);国家青年科学基金(51302242);江苏省自然科学基金(BK2012530)

摘　　要：对真空玻璃焊料进行烧结实验,研究了封接焊料与玻璃基体的封接性能。封接焊料的热膨胀系数为9.1×10-6K^(-1),与钠钙玻璃(CET:10.2×10^(-6)K^(-1))的热膨胀系数相近;进行了不同温度下封接焊料的烧结实验,得到了PbO-TiO_2-SiO_2-R_xO_y系统封接焊料的使用温度为(460±10)℃;将烧结冷却后的样品看成浸润模型,对不同温度下封接焊料的铺展面积及润湿角进行测量,温度的升高会使封接焊料与玻璃基体表面的润湿性变好,焊料的铺展面积增大,浸润角变小;观察研究了该系统封接焊料与钠钙玻璃基体润湿后的界面结合特性,焊料与玻璃基体表面润湿后界面处会形成的过渡层带,在一定程度上利于提高封接焊料与玻璃基体连接。Sealing properties of solder powder sintering with glass substrate was studied through sealing experiments. Thermal expansion coefficient of the sealing solder is 9. 1 × 10^-6K^-1 close to soda lime glass（ CET： 10. 2 × 10^-6K^-1）. Sealing solder sintering experiments was performed at different temperatures. By observing the sintering properties,the using temperature of Pb O-TiO2-SiO2-RxOy system sealing solder is（ 460 ± 10） ℃. The cooling samples was seemed as the wetting model. Wetting angles and spread area of the solder sealing was measured at different temperatures. When the sealing temperature increases,the wetting angles decreases and the spread area increases. The wetting properties of the sealing solder with soda lime glass substrates become well. After the sealing solder wetted with the soda lime glass substrate,the interfacial bonding properties was studied. The transition layer is formed between the interface the glass substrate and the sintering properties can be improved to some extent.

关 键 词：真空平板玻璃 封接焊料 浸润性 界面结合 

分 类 号：TB321[一般工业技术—材料科学与工程]