高碳钢/不锈钢TLP扩散连接层组织及形成机理  

Microstructure and forming mechanism of TLP diffusion bonding zone between high carbon steel and stainless steel

作　　者：柳秉毅[1,2] 杨宗辉[1,2] 初雅杰[1,2] 谈淑咏[1,2] 陈锐杰[2] 

机构地区：[1]南京工程学院江苏省先进结构材料与应用技术重点实验室,江苏南京211167 [2]南京工程学院材料工程学院,江苏南京211167

出　　处：《材料热处理学报》2015年第12期179-184,共6页Transactions of Materials and Heat Treatment

基　　金：南京工程学院创新基金重大项目(CKJA201404);南京工程学院博士基金项目(ZKJ201303)

摘　　要：用光学显微镜、扫描电镜和显微硬度分析等方法研究了65钢和T10钢与304不锈钢瞬间液相(TLP)扩散连接形成的结合区组织,并对其形成机理进行了探讨。结果表明,以铜箔作中间层,采用TLP扩散连接工艺可实现高碳钢与不锈钢之间的良好冶金结合;结合区组织为明显的层状结构,从高碳钢向不锈钢方向依次为铜扩散层、高碳富铬层和定向生长的铁-铬-镍柱状晶层。分析认为,高碳钢/不锈钢TLP扩散连接过程具有明显的不对称性。高碳钢/铜液界面析出的强稳定性高碳富铬层具有屏蔽作用,阻止高碳钢母材向铜液中溶解;而不锈钢母材则持续向铜液中溶解,溶解的铁、铬、镍原子经最短扩散路径朝高碳富铬层一侧迁移,进而发生等温凝固并择优定向生长出铁-铬-镍固溶体柱状晶区。The microstructure of the transient liquid phase（ TLP） diffusion bonding zones of 65 steel /304 steel and T10 steel /304 steel was examined by OM,SEM,EDS and microhardness tester and its forming mechanism was discussed. The results show that the metallurgical bonding between high carbon steel and stainless steel is achieved by TLP diffusion bonding using Cu as interlayer. The bonding zone is the multilayer structure consisting of Cu diffuse layer,Cr-rich layer with high content of C and directional growing Fe-Cr-Ni columnar grain range. It indicates that the dissymmetry exists obviously in TLP diffusion bonding process of high carbon steel and stainless steel. Stable Cr-rich phase with high content of C,which firstly forms at the interface between high carbon steel and copper,effectively prevents further dissolution of high carbon steel into the copper solution. At the interface between stainless steel and copper,the Fe,Cr and Ni atoms dissolve from stainless steel into the copper solution. Then the isothermal solidification of Fe-Cr-Ni solid-solution occurs and the directional columnar grains are obtained through continuing diffusion of Fe,Cr and Ni atoms from dissolving stainless steel to the growing top of the columnar grains.

关 键 词：高碳钢 不锈钢 瞬间液相扩散连接 组织 形成机理 

分 类 号：TG142.1[一般工业技术—材料科学与工程]