水杨酸改性咪唑环氧树脂固化促进剂的合成与性能研究  

Synthesis and performance of bysalicylic acid-modified imidazole as curing catalyst of epoxy resins

作　　者：程秀莲[1] 郭小伟[1,2] 杨莹[1] 周琦[3] 霸书红[1] 

机构地区：[1]沈阳理工大学装备工程学院,辽宁沈阳110159 [2]辽沈工业集团有限公司,辽宁沈阳110045 [3]沈阳理工大学环境与化学工程学院,辽宁沈阳110159

出　　处：《粘接》2016年第1期48-51,共4页Adhesion

摘　　要：研究了水杨酸改性咪唑的制备方法及工艺,对改性咪唑固化性能的影响,用涂膜硬度表征固化性能。结果表明,水杨酸改性咪唑的较佳制备工艺为水杨酸与咪唑的物质的量比为1:1,研磨混合均匀,室温放置1 h。水杨酸改性咪唑可使双氰胺的固化温度降至140℃,固化240 min,硬度为4H。水杨酸改性咪唑与咪唑作为双氰胺固化促进剂相比,其潜伏性有大幅度提高,耐热性亦比咪唑高。The preparation methods and process of salicylic acid modified imidazole and its influence on the curing performance were investigated. The curing performance was characterized with the film hardness. The results showed that the better modifying conditions of the salicylic acid-modified imidazole were as follows： the mole ratio of salicylic acid to imidazole was 1：1; they were grinded and mixed uniform and placed at room temperature for 1 hour; the curing temperature for dicyandiamide was decreased to 140~（2 by salicylic acid-modified imidazole, and when cured at 140qC for 240 min, the hardness of cured resin film was 4H. The latency of salicylic acid-modified imidazole used as the curing catalyst of dicyandiamide was substantially higher than that of imidazole. The heat resistance of salicylic acid-modified irnidazole was higher than imidazole.

关 键 词：环氧树脂 双氰胺 水杨酸 咪唑 潜伏性 

分 类 号：TQ433.437[化学工程]