中温酸性化学镀Ni-Cu-P合金镀层腐蚀行为研究  

Research on Corrosion Behavior of Middle Temperature Acidic Electroless Ni-Cu-P Alloy Coating

作　　者：亢淑梅[1] 陈婷婷[1] 彭启超[1] 孙思航 刘宇楠[1] 

机构地区：[1]辽宁科技大学材料与冶金学院,辽宁鞍山114051

出　　处：《电镀与精饰》2016年第1期6-9,共4页Plating & Finishing

基　　金：鞍山市科技计划项目资助(2012000386)

摘　　要：在中温酸性条件下用化学沉积方法制备了Ni-Cu-P合金镀层,采用扫描电镜、能谱分析仪及Autolab工作站研究了镀层的耐蚀性能,确定了化学镀Ni-Cu-P合金的最佳工艺。其最佳工艺为:25 g/L NiSO_4·6H_2O,0.05 g/L CuSO_4·5H_2O,40 g/L C_6H_5Na_3O_7·2H_2O,25 g/L NaH_2PO_2·H_2O、15 g/L CH_3COONa,0.03 g/L KIO_3,0.01 g/L C_(12)H_(25)NaO_4SO_3,pH为(4.75±0.01),θ为(80±1)℃,沉积t为2 h。研究结果显示,中温酸性化学镀Ni-Cu-P合金镀层的腐蚀电流密度明显低于化学镀镍-磷合金镀层以及基体材料的腐蚀电流密度,其耐蚀性得到显著提高。In this paper, Ni-Cu-P alloy coating was prepared by chemical deposition method under middle temperature condition, and corrosion resistance of the coating was researched by scanning electron microscope, energy disperse spectroscope and Autolab workstation. The optimum process of Ni-Cu-P alloy electroless plating was determined as follows： 25g/L NiSO4 ·6H2O, 0. 05g/L CuSO4 · 5H2O, 40g/L C6H5Na3O7·2H2O,25g/L NaH2PO2 ·H2O,15g/L CH3COONa,0.03g/L KIO3,0.01g/L C12 H25 NaO4 SO3, pH = 4.75 ＋ 0.01,0 = 80 ± 1℃, t = 2 h. Researching results showed that the corrosion current density of middle temperature acidic electroless Ni-Cu-P coating was obviously lower than that of electroless Ni-P alloy coating and base material, and the corrosion resistance was significantly improved.

关 键 词：化学镀 Ni—Cu—P合金镀层 电化学腐蚀 耐蚀性 

分 类 号：TQ153.12[化学工程—电化学工业]