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作 者:何丹[1] 秦宗慧[1] 孙悦庆[2] 唐薇[1] 王清[1]
机构地区:[1]华东理工大学机械与动力工程学院,上海200237 [2]宝山钢铁股份有限公司冷轧薄板厂,上海201900
出 处:《电镀与涂饰》2016年第1期19-22,共4页Electroplating & Finishing
摘 要:根据某钢厂电镀锡生产线的锡溶解系统设计了锡溶解的实验装置,并用此装置进行溶锡试验,以研究通氧量、温度、压力、镀液循环量等工艺参数对溶锡量和锡粒利用率的影响。结果表明:溶锡速率主要由通氧量决定,较适宜的通氧量为24 L/h;在1.6~3.5m^3/h范围内,提高镀液循环量可提高溶锡量和锡粒利用率。随温度和压力增大,溶锡量逐渐增大,锡粒利用率先升后降,较适宜的溶锡温度和压力分别为40~45℃和0.6MPa。A set of experimental facility was designed according to the tin dissolution system of a production line for tin plating in a steel plant. The effects of process parameters including oxygen flow rate, temperature, pressure and circulation volume of bath on the tin dissolution amount and tin particle utilization were studied through tin dissolution tests using the given facility. The results showed that the rate of tin dissolution is mainly decided by oxygen flow rate, and the suitable oxygen flow rate is 24 L/h. The tin dissolution amount and tin particle utilization can be raised by increasing the circulation volume of bath in the range of 1.6-3.5 m3/h. With the increasing of temperature and pressure, the tin dissolution amount is increased gradually, while the particle utilization is increased firstly and then decreased. The suitable temperature and pressure for tin dissolution are 40-45 ~C and 0.6 MPa, respectively.
分 类 号:TG174.36[金属学及工艺—金属表面处理]
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