轴套内表面微结构掩膜电解加工模拟及试验研究  

Simulation and Experimental Study on Through-mask Electrochemical Micromachining Process for Micro-texturing on Inner Surface of Bushing

作　　者：宋义雄 王权岱[1] 王莉[2] 李辉[1] 李言[1] 

机构地区：[1]西安理工大学机械与精密仪器工程学院,西安710048 [2]西安交通大学机械制造系统工程国家重点实验室,西安710054

出　　处：《机械科学与技术》2016年第2期267-272,共6页Mechanical Science and Technology for Aerospace Engineering

基　　金：国家自然科学基金项目(51375381);西安理工大学博士科研启动基金项目(102-211003)资助

摘　　要：掩膜电解加工是金属基底表面织构化的有效手段,为了实现在轴套内表面阵列微结构的加工,进行了活动掩膜电解加工方法的仿真与试验研究。建立了活动掩膜电解加工有限元计算模型,通过数值计算分析了图形分布均匀性及掩膜厚度影响电流密度分布的规律和机理。结果表明:采用掩膜和阴极一体化的这种特殊电极结构形式,加工非均匀占空比图形时更有利于得到一致的加工深度;通过控制掩膜厚度与图形特征尺寸的关系,可以控制所加工的微结构底部形状。以仿真计算结论为依据进行了掩膜电解试验优化,并采用优化的工艺参数在轴套的内表面加工出了直径为100μm的微坑阵列。Through-mask electrochemical micromachining （TM-EMM） is an effective method for surface texturing of metal substrate. To fabricate the microstructure array on the inner surface of bushing, the simulations and experiments for TM-EMM have been conducted. The finite element model has been built and the influence laws and mechanisms of pattern distribution nonuniformity and mask thickness on the current density distribution have been investigated. The numerical calculation results show that adoption of the all-in-one style of mask and cathode facilitates more uniform etched depth for machining on surface with nonuniform pattern distribution and the bottom topography of etched microstructure can be regulated by regulating the ratio of mask thickness and patter size. Based on the simulation results, machining parameters optimization have been experimentally conducted and the micro-pits with a diameter of 100 μm have successfully fabricated under the optimized conditions.

关 键 词：掩膜电解 微结构 轴套 数值模拟 

分 类 号：TH662[机械工程—机械制造及自动化]