凹版印刷滚筒快速镀锌工艺的研究  

Study on Fast Zinc-Electroplating Process for Gravure Cylinder

作　　者：吴伟权[1] 缪凤 万传云[1] 何云庆 

机构地区：[1]上海应用技术学院化学与环境工程学院,上海201418 [2]江苏澳光电子有限公司,江苏盐城224222

出　　处：《电镀与环保》2016年第1期8-11,共4页Electroplating & Pollution Control

摘　　要：采用钾盐镀锌工艺研究快速镀锌。探讨了温度、搅拌及添加剂对电流密度范围及镀层质量的影响。结果表明:适当升高温度及采用搅拌,能够提高电流密度上限,有利于在短时间内获得较厚的镀层。同时,添加剂CT的加入能够改善镀液的分散能力并提高镀层的质量。优化配方的电流密度上限可达到15A/dm2,能够实现快速镀厚锌。Fast zinc-electroplating in potassium salts was studied, and the effects of temperature, agitation and additive on current density range and coating quality were investigated. Results showed that raising temperature and applying agitation can increase the limited current density, and were beneficial to obtain thicker coating in short time. Moreover, adding CT can improve bath dispersion performance and coating quality. Under optimum conditions, the limited current density reach up to 15 A/dm^2 and fast zinc-electroplating can be realized.

关 键 词：钾盐镀锌 快速电镀 添加剂 

分 类 号：TQ153[化学工程—电化学工业]