硫酸铈与硫酸铜对化学镀镍的影响  

Influences of Ce(SO_4)_2 and CuSO_4 on Electroless Nickel Plating

作　　者：郑智[1] 李雨[2] 刘定富[2] 

机构地区：[1]贵州大学喀斯特环境与地质灾害防治教育部重点实验室,贵州贵阳550025 [2]贵州大学化学与化工学院,贵州贵阳550025

出　　处：《电镀与环保》2016年第1期27-30,共4页Electroplating & Pollution Control

摘　　要：以反应活化能、镀速、镀层中磷的质量分数和镀层光泽度为评价指标,研究了Ce(SO_4)_2和CuSO_4对柠檬酸体系化学镀镍的影响。结果表明:添加Ce(SO_4)_2和CuSO_4均能降低反应体系的活化能;将50mg/L Ce(SO_4)_2和7.5mg/L CuSO_4进行复配,镀速达到15.427 6μm/h,镀层中磷的质量分数为10.58%,镀层光泽度为228Gs。Influences of Ce（SO4）2 and CuSO4 on citric acid system electroless nickel plating were investigated selecting reaction activation energy, plating rate, phosphorus mass fraction in coating and coating glossiness as evaluation index. Results showed that Ce（SO4）2 and CuSO4 can lower the reaction activation energy. Furthermore, under the conditions of Ce（SO4）2 50 mg/L and CuSO4 7. 5 mg/L, the plating rate reached up to 15. 427 6 μm/h, the phosphorus mass friction in coating was 10.58% and the coating glossiness was 228 Gs.

关 键 词：化学镀镍 镀速 镀层中磷的质量分数 镀层光泽度 

分 类 号：TQ153[化学工程—电化学工业]