镀锡板有机钝化工艺的研究  

Study of Organics Passivation Process for Tin Plate

作　　者：马梦迪[1] 刘志江[1] 邵忠财[1] 张庆芳[1] 

机构地区：[1]沈阳理工大学环境与化学工程学院,辽宁沈阳110159

出　　处：《电镀与环保》2016年第1期33-35,共3页Electroplating & Pollution Control

摘　　要：采用有机钝化体系对镀锡板进行钝化处理。通过点滴试验和电化学测试对钝化膜的耐蚀性进行检测,并用扫描电子显微镜观察了钝化膜的表面形貌。得到的较优工艺配方为十二烷基磺酸钠4.5g/L+植酸6.0g/L。所得钝化膜的自腐蚀电流密度最小,为1.235×10^(-6)A/cm^2;极化电阻最大,为5 094.1Ω;自腐蚀电位正移0.117V;点滴时间增加20s。采用该钝化工艺能提高镀锡板的耐蚀性。Organics passivation process for tin plate was studied. The corrosion resistance of passive film was tested through dropping experiment and electrochemical testing, and the surface morphology was observed by scanning electron microscopy. The optimum process formula was determined as follows： sodium dodecyl sulfate 4.5 g/L and phytic acid 6.0 g/L. Results showed that, using the optimum formula, the selbcorrosion current density was minimum and it was 1. 235 ×10^-6A/cm^2 , the polarization resistance was maximum and it was 5 094.1 Ω. The sell corrosion potential shifted 0. 117 V and the dropping time increased 20 s. Moreover, the corrosion resistance of tin plate was improved.

关 键 词：镀锡板 有机物 钝化膜 

分 类 号：TG174[金属学及工艺—金属表面处理]