串、并行设计对硬件产品设计缺陷的影响分析  

Research on the design defect formation of hardware product based on parallel and serial design patterns

作　　者：肖承地[1] 刘卫东[1,2] 郑慧萌[1] 胡伟立[1] 

机构地区：[1]南昌大学机电工程学院,江西南昌330031 [2]南昌航空大学经管学院,江西南昌330063

出　　处：《机械设计》2016年第1期1-8,共8页Journal of Machine Design

基　　金：国家自然科学基金资助项目(71161018);江西省教育厅资助项目(12717)

摘　　要：串、并行设计模式下硬件产品的设计缺陷形成机理存在差异,对串、并行设计模式与设计缺陷之间的关系进行系统地分析、比较,有助于在产品设计过程中预防、控制设计缺陷。采用过程方法,分别构建了从输入、输出、资源、环境和监测评价活动五个方面系统反映串、并行设计各阶段缺陷影响因素的结构要素模型,进而迭代获得描述串、并行设计过程各设计阶段、各类设计缺陷和可能存在的缺陷因素三者之间的结构关系模型。在此基础上,利用区间层次分析法定量地表达了串、并行设计的设计缺陷与其影响因素之间的关系。最后,从设计缺陷预防和控制的角度,对串、并行设计模式下设计缺陷结构关系进行比较与分析,研究成果对设计过程中预防和控制设计缺陷具有理论和实际指导意义。There were differences in design defects formation mechanism between serial and concurrent design modes. The relationships between serial, parallel design modes and design defects were analyzed systematically, which was useful to pre- vent and control design defect under the limited conditions. With the process method, the structural element model of defect af- fecting factors were reflected from 5 aspects of input, output, resources, environment .and evaluation, respectively. The struc- tural relationship model of the design process, design defects and their influencing factors were established through the iteration during serial and parallel design process. The relationships between design defects and their influence factors under the sequen- tial and concurrent design patterns were described quantitatively using interval analytic hierarchy process （IAHP）. Finally, the summary and comparison was performed on the structural relationships of design defects between sequential and concurrent de- sign process from the perspective of prevention and control of design defect. The findings were expected to be both theoretically and practically useful for controlling and preventing defects.

关 键 词：设计缺陷 影响因素 过程方法 区间层次分析方法 

分 类 号：TH122[机械工程—机械设计及理论]