Cu-金刚石复合镀层的制备  

Preparation of Cu-diamond composite coating by composite electroplating

作　　者：马如龙[1] 彭超群[1] 王日初[1] 王小锋[1] 张纯[1] 谭时雨 

机构地区：[1]中南大学材料科学与工程学院,长沙410083

出　　处：《中国有色金属学报》2015年第12期3414-3421,共8页The Chinese Journal of Nonferrous Metals

摘　　要：采用复合电镀技术,在酸性硫酸盐镀铜电镀液中加入粒径为20μm的金刚石粉体制备Cu-金刚石复合镀层。通过正交试验优化Cu-金刚石复合电镀的工艺参数,采用扫描电镜(SEM)、能谱仪(EDS)和显微硬度计研究CuSO_4·5H_2O浓度、阴极电流密度、金刚石粉体浓度和镀液温度对镀层质量的影响。采用X射线分析仪(XRD)、扫描电镜(SEM)和摩擦实验机表征优化后复合镀层的相结构、表面形貌及摩擦性能。结果表明:优化的镀液组成和工艺参数为CuSO_4·5H_2O 190 g/L,H_2SO_4 60 g/L,阴极电流密度10 A/dm^2,金刚石粉体浓度20 g/L,镀液温度20℃;优化后的复合镀层晶粒均匀,金刚石粉体质量分数为21.50%,具有较好的显微硬度和摩擦性能。The Cu-diamond composite coating was prepared by composite electroplating when diamond particles with diameter of 20 μm were put into acidic sulfate copper plating solution.The optimized technological conditions of Cu-diamond composite electroplating were obtained by orthogonal test.The effects of CuSO4·5H2O concentration,cathode current density,diamond concentration and temperature on the quality of Cu-diamond composite coatings were investigated by SEM,EDS and microhardness tester.The phase structure,surface morphology and tribological properties were investigated by XRD,SEM and friction-abrasion testing machine.The results show that the optimized technological conditions are CuSO4·5H2O 190 g/L,H2SO4 60 g/L;cathode current density,10A/dm^2;diamond concentration,20 g/L;temperature,20℃.The Cu-diamond composite coating containing 21.50%diamond particles has homogeneous grains,better microhardness and tribological performance.

关 键 词：复合电沉积 硫酸铜 浓度 阴极电流密度 金刚石粉体 Cu-金刚石 复合镀层 摩擦性能 

分 类 号：TQ153.4[化学工程—电化学工业]