基于热仿真分析的某机载电子模块设计方案评估  

Design Project Assessment of an Airborne Electronic Module Based on Thermal Simulation Analysis

作　　者：董伟[1] 刘世卿[1] 

机构地区：[1]中航工业西安航空计算技术研究所,西安710115

出　　处：《机械工程师》2016年第1期119-121,共3页Mechanical Engineer

摘　　要：机载电子设备越来越精密、集成度越来越高,而使用环境更为恶劣,使得机载电子设备的热设计越来越重要,采用热仿真分析是热设计的主要手段。文中通过对某机载电子模块的4种工况进行仿真对比分析,综合考虑散热效果及可靠性,确定了最优方案,指导了模块的方案设计。该方案已随电气设计和结构设计一起通过了各项验证试验,使用情况良好,为后续机载电子模块的设计积累了经验,具有较大的参考价值。With the increasing precision, higher integration and worse working environment of the airborne electronic equipment, thermal design is becoming more and more important, and thermal simulation is the main method for thermal design. An optimal solution has been determined by simulating and analyzing four working conditions of an airborne electronic module considering heat dissipation effect and reliability in this article, which guides the module project design.This solution, along with electrical design and structure design, is verified by all the experiments, and the use of this module is good. The result has accumulated experience for airborne electronic module design. The experience has great reference value.

关 键 词：机载电子模块 热设计 热仿真 

分 类 号：TP391.7[自动化与计算机技术—计算机应用技术]