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机构地区:[1]北京交通大学,北京100044
出 处:《稀有金属材料与工程》2011年第S1期252-256,共5页Rare Metal Materials and Engineering
基 金:北京交通大学基本科研业务费资助项目(2009JBM085);北京交通大学"十一五"重点基金项目(2006XZ003)
摘 要:采用电弧焊方法选择多组不同的焊接工艺参数进行Ti3AlC2陶瓷与Cu合金的焊接,观察分析接头的显微结构,测试焊接件的四点弯曲强度。结果表明,在适当的电弧电流密度IA、拉弧持续时间tA和接合压力p下形成具有高强度的接头显微结构:在靠近Cu合金的区域,自生成的细小TiCx均匀弥散在Cu合金网络;在靠近Ti3AlC2陶瓷区域形成TiCx相与Cu合金相交替层叠的特殊结构。当IA≥6A/mm2或tA≥3s,p<0.8MPa时将促使TiCx颗粒的聚集长大和接头空洞的大量生成,从而限制接头强度的提高。The arc welding of Ti3AlC2 ceramic to Cu alloy was carried out under multiple sets of welding parameters. The microstructure of joints was observed and the four-point bending strength of the welded samples was tested. The results show that high-strength microstructure of joints is formed at appropriate current density of arc IA, arc duration tA and bonding pressure p. In the zones adhered to Cu alloy, self-generated micro TiCx particles disperse uniformly in the network of Cu alloy. While in the zones adhered to Ti3AlC2 ceramic, the TiCx layers and Cu alloy layers stack alternately. When IA≥6 A/mm2 or tA≥3 s, p<0.8 MPa, TiCx particles grow and aggregate and a large number of cavity pockets is generated, thus the strength of joint being limited.
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