Influence of Mn on wettability and microstructure of low-silver lead-free solders  

作　　者：张群超 张富文 赵朝辉 张品 胡强 

机构地区：[1]National Engineering Research Centre for Nonferrous MetalComposites, General Research Institute for Nonferrous Metals, Beijing, 100088 [2]Beijing COMPO Advanced Technology Co. , Ltd, Beijing, 101400

出　　处：《China Welding》2015年第3期11-17,共7页中国焊接（英文版）

摘　　要：The influence of Mn on wettability and microstructure of low-silver solders was investigated. Mn degrades the wettability of low-silver solders, while the wettability of the Mn doping solders does not change with Mn content in a linear way. As a result of Mn doping, the cellular/dendritic β-Sn and the eutectic phase are refined. It indicates that Mn promotes the spontaneous and heterogeneous nucleation process of the solder alloys. The growth of intermetallic compound on the joint inter＇ace during soldering is also restrained. Aging experiment shows that Mn suppresses the growth of Cu3Sn and Cu6Sn5 layers at the joint interface.The influence of Mn on wettability and microstructure of low-silver solders was investigated. Mn degrades the wettability of low-silver solders, while the wettability of the Mn doping solders does not change with Mn content in a linear way. As a result of Mn doping, the cellular/dendritic β-Sn and the eutectic phase are refined. It indicates that Mn promotes the spontaneous and heterogeneous nucleation process of the solder alloys. The growth of intermetallic compound on the joint inter＇ace during soldering is also restrained. Aging experiment shows that Mn suppresses the growth of Cu3Sn and Cu6Sn5 layers at the joint interface.

关 键 词：MN low-silver solder INTERFACE MICROSTRUCTURE 

分 类 号：TG425.1[金属学及工艺—焊接] TN105[电子电信—物理电子学]