TiO_2纳米颗粒掺杂对Sn-3.0Ag-0.5Cu-xTiO_2焊点界面Cu_6Sn_5 IMC晶粒生长的影响机理  

Influence of nano-TiO_2 dopant on Cu_6Sn_5 IMC grain ripening growth in Sn-3.0Ag-0.5Cu-xTiO_2 solder joints

作　　者：唐宇[1,2] 骆少明[1] 王克强[1] 李国元[2] 

机构地区：[1]仲恺农业工程学院自动化学院,广州510225 [2]华南理工大学电子与信息学院,广州510640

出　　处：《焊接学报》2015年第12期56-60,116,共5页Transactions of The China Welding Institution

基　　金：中央高校基本科研业务费专项资金资助项目(2014ZB0032);广东省自然科学基金资助项目(2014A030313594);广东省科技计划资助项目(2014A020208139;2015A020209179);广东高校特色创新资助项目(KA1548812)

摘　　要：研究了Ti O2纳米颗粒掺杂影响回流焊过程中Sn-3.0Ag-0.5Cu-x Ti O2焊点界面Cu6Sn5金属间化合物(intermetallic compound,IMC)晶粒生长机理.基于Cu原子扩散通量驱动晶粒成熟生长(flux driven ripening,FDR)理论模型分析了Cu6Sn5IMC晶粒生长机理.结果表明,Ti O2纳米颗粒掺杂改变了焊点界面Cu6Sn5IMC晶粒形貌和尺寸.含Ti O2纳米颗粒的焊点Cu6Sn5IMC晶粒尺寸要小于不含Ti O2纳米颗粒的焊点,且晶粒分布要更加均匀.试验数据与FDR理论模型基本吻合.Cu6Sn5IMC晶粒生长指数分别为0.346,0.338,0.332和0.342,这说明Cu6Sn5IMC晶粒生长是由原子互扩散和晶粒成熟共同控制.Effect of nano-TiO 2dopant on Cu6Sn5 IMC grain ripening growth in Sn-3. 0Ag-0. 5Cu-xT iO 2solder joints during reflow process was investigated in this study. Flux-driven ripening( FDR) theoretical model is adopted to analyze the Cu6Sn5 IMC grain ripening growth mechanism. Results show that nano-TiO 2dopant could alter both the morphology and size of Cu6Sn5 IMC grain. The size of Cu6Sn5 IMC grain in TiO 2-containg solder joints is smaller than that in TiO 2-free solder joints,and the Cu6Sn5 IMC grain in TiO 2-containg solder joints is more uniform and evenly distributed than those in TiO 2-free solder joints. The FDR theoretical model was well consistent with the experimental data. The growth exponents of Cu6Sn5 IMC grain in Sn-3. 0Ag-0. 5Cu-xT iO 2solder joints are 0. 346,0. 338,0. 332,and 0. 342,respectively. This indicates that Cu6Sn5 IMC grain growth is controlled by atomic interdiffusion and grain maturity.

关 键 词：无铅焊料 二氧化钛纳米颗粒 金属间化合物 晶粒成熟 回流焊 

分 类 号：TG425[金属学及工艺—焊接]