FDM 3D打印机半导体制冷温控设计及其冷却实验研究  

Temperature control with semiconductor refrigeration for FDM 3D printer and cooling experimental validation

作　　者：靳一帆 万熠[1] 张冰 任冰[1] 

机构地区：[1]山东大学机械工程学院,高效洁净机械制造教育部重点实验室,山东济南250061 [2]山东省特种设备检验研究院,山东济南250101

出　　处：《机电工程》2016年第2期165-168,216,共5页Journal of Mechanical & Electrical Engineering

基　　金：国家自然科学基金资助项目(51175306,51575320);山东大学基本科研业务费专项资金资助项目(2014JC020)

摘　　要：针对熔融沉积(fused deposition modeling,FDM)3D打印过程中打印大斜率小截面结构时,因散热不良引起的层错位和坍塌问题,对传统FDM 3D打印机PID温度控制方案中存在的问题进行了分析,将半导体制冷技术应用于3D打印过程温度控制之中,设计开发了一种功率可调型半导体制冷系统,对不同散热条件下发生层错位和坍塌问题的角度范围进行了测量和对比。研究结果表明,所设计的半导体制冷系统冷端温度最低可达3.1℃,其热端温度可控制在65℃以下,改善了大斜率小截面结构3D打印过程的散热条件;采用该制冷系统后打印试样发生层错位和坍塌的角度范围比无散热条件时发生上述问题的角度范围减小了50%以上,比普通风扇冷却条件下发生上述问题的角度范围减小了25%以上。Aiming at solving layer displacement and collapse problem of the deep-slope and small cross-section structure caused by poor cooling condition during the fused deposition modeling（ FDM） 3D printing process,the problems existing in the traditional PID temperature control method were analyzed. A power adjustable semiconductor refrigeration system was developed based on semiconductor refrigeration technology. Finally,experiment was conducted at different cooling conditions and the piece angle range of layer displacement and collapse was measured to contrast. The results indicate that the cold end of the system designed can reach as low as 3. 1 ℃ and the temperature of hot end is controlled below 65 ℃,which can improve the cooling conditions,and the piece angle range of layer displacement and collapse using the designed system can be reduced by 50% than that of natural condition and by 25% than that of fan cooling.

关 键 词：半导体制冷 熔融沉积 大斜率小截面 温度控制 

分 类 号：TH166[机械工程—机械制造及自动化] TB61[一般工业技术—制冷工程]