薄膜体声波谐振器的热学分析  

Thermal Characteristics Analysis of Thin Film Bulk Acoustic Resonator

作　　者：张睿[1] 焦向全[1] 马晋毅[2] 杜波[2] 钟慧[1] 石玉[1] 

机构地区：[1]电子科技大学电子薄膜与集成器件国家重点实验室,四川成都610054 [2]中国电子科技集团公司第二十六研究所,重庆400060

出　　处：《压电与声光》2016年第1期1-4,共4页Piezoelectrics & Acoustooptics

基　　金：国家自然基金资助项目(61101038;61471086);四川关键技术研究发展基金资助项目(2011GZ0220);中央高校基础研究基金资助项目(ZYGX2012J031)

摘　　要：采用有限元分析软件Comsol Multiphics构建谐振器三维模型,研究器件结构、材料对其热性能的影响。固态装配型谐振器(SMR)有更好的热传导能力与热应力稳定性。在SMR器件中增加一层SiO2,其最高稳态温度上升7℃。器件最高稳态温度随其谐振区面积的减小而迅速增大。当器件换用高热导率材料时,器件最高稳态温度及其随热耗散功率增加而增大的幅度明显降低。A finite element simulation software Comsol Multiphsics was employed to build three-dimensional bulk acoustic wave（BAW）resonators model.The influences of different structure and materials on the thermal characteristics of the BAW resonators were investigated.The calculation results revealed that the solid mounted resonators（SMR）had better thermal reliability than that of film bulk acoustic resonators.Adding SiO2 layer into the SMR will increase the steady-state temperature of 7℃.The highest steady-state temperature will increase rapidly with the decrease of the resonant area of SMR.The steady-state temperature decreased greatly when the high thermal conductivity materials are used to replace materials of low thermal conductivity in SMR.

关 键 词：薄膜体声波谐振器 有限元 热学分析 COMSOL 大功率 

分 类 号：TN713.2[电子电信—电路与系统]