钨粉粒度和形状对选区激光熔化W-xCu成形与显微组织的影响  

Effect of Tungsten Powder Particle Size and Shape on Consolidation and Microstructure of W-xCu Composites by Selective Laser Melting

作　　者：闫岸如[1] 杨恬恬[1] 王燕灵[1] 马志红 杜云 王智勇[1] 

机构地区：[1]北京工业大学激光工程研究院,北京100124 [2]成都三鼎日新激光科技有限公司,四川成都610000

出　　处：《中国激光》2016年第2期91-99,共9页Chinese Journal of Lasers

基　　金：国家科技重大专项(2010ZX04013-052)

摘　　要：为获得高精度、高致密度W-Cu复合材料零部件,试验选用了两种不同形状、粒度的W粉与同种Cu粉按照不同质量比混合进行选区激光熔化(SLM)。研究了试样的尺寸精度、表面形貌与显微组织。采用D_(50)=5μm、形状不规则W粉的W-Cu混合粉末,铺粉过程不均匀,烧结中飞溅严重,随着W的质量分数从60%增加至75%,成形试样高度方向收缩量从70μm增加至220μm,长度、宽度方向膨胀量分别从50μm增长至150μm、从70μm增长至150μm,成形试样表面从较多黏着物演变为球化明显,金相中存在气孔,W相发生团聚。采用D_(50)=20μm、形状规则W粉的W-Cu混合粉末,铺粉过程均匀,烧结中无明显飞溅,随着W的质量分数从60%增加至75%,成形试样高度方向收缩量从20μm增加至60μm,宽度、长度方向膨胀量从20μm增长至50μm,成形试样表面从平整向熔道断续发展,W相发生颗粒重排。D_(50)=20μm、形状规则的W粉更适宜选区激光熔化制作W-Cu复合材料。In order to manufacture tungsten-copper complicate parts with high precision and densification, two different characterizations of tungsten powder balled with copper powder are manufactured by selective laser melting （SLM）. The dimensional accuracy, surface morphology and microstructure of specimens are studied. The composite powder containing irregular tungsten powder with D5o=5 μm causes non-uniform rolling powder and serious sparks occur in sintering process. With the increasing of mass content of W from 60% to 75%, the height shrinkage increases from 70 μm to 220 μm, the length and width increase from 50 μm to 150 μm, from 70 μm to 150 μm, respectively. The surface morphology evolves from adhered debris to balling phenomenon, pores and W particle agglomerate exist in the microstructures. The composite powder containing regular tungsten powder with D50=20 μm shows uniform rolling powder process and no sparks occur in sintering. With the increasing of mass content of W from 60% to 75%, the height shrinkage increases from 70 μm to 220μm, the length and width increase from 20 μm to 50 μm, the surface morphology evolves from sound to slightly melt fracture and the particle rearrangement is obvious. The regular tungsten powder with D50=20 μm is more applicable to manufacturing W- Cu components by selective laser melting than the irregular tungsten powder with D20 μm.

关 键 词：激光光学 选区激光熔化 粒度 形状 尺寸精度 表面形貌 显微组织 

分 类 号：TN24[电子电信—物理电子学] TG665[金属学及工艺—金属切削加工及机床]