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作 者:陈川[1] 周元祥[1] 范晨晨 刘专[1] 张涛[1]
机构地区:[1]合肥工业大学资源与环境学院,安徽合肥230009
出 处:《电镀与涂饰》2016年第3期159-163,共5页Electroplating & Finishing
摘 要:采用铁碳微电解法处理某印制线路板厂的化学镀铜废水。介绍了其原理,探究了不同因素对废水处理效果的影响,得到较优的工艺条件为:初始pH 4.0,铁炭质量比3∶2,铁炭总量25 g/L,曝气量1.6 L/min(对于200 m L废水而言),处理时间30 min。在较优工艺条件下,出水Cu^(2+)的质量浓度和COD分别为0.19 mg/L和40.52 mg/L,去除率分别为99.5%和70.1%,达到GB 21900–2008中表3的排放要求。The electroless copper plating wastewater from a printed circuit board factory was treated by iron-carbon micro-electrolysis. The related mechanism was introduced, and the effects of operation conditions on treatment efficiency were studied. The optimal operation conditions were obtained as follows: initial pH 4.0, mass ratio of cast iron to activated carbon 3:2, total dosage of cast iron and activated carbon 25 g/L, aeration rate 1.6 L/min (for 200 mL wastewater) and treatment time 30 rain After treating under the optimal conditions, the mass concentration of Cu2+ and COD in the effluent is 0.19 mg/L and 40.52 mg/L respectively, with a removal efficiency of 99.5% and 70.1% respectively, meeting the emission requirements of Table 3 in GB 21900-2008 standard.
关 键 词:化学镀铜废水 铁碳微电解 铜离子 化学耗氧量 去除
分 类 号:X703.1[环境科学与工程—环境工程]
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