铜层厚度及退火温度对ZnS/Cu/ZnS复合薄膜显微结构与性能的影响  

Effects of Thickness of Copper Layer and Annealing Temperature on Microstructure and Properties of ZnS/Cu/ZnS Composite Film

作　　者：王梦慧[1] 易叶帆 鲍恩成 饶项炜 李晓涵[1] 刘劲松[1,2] 李子全[1,3] 

机构地区：[1]南京航空航天大学材料科学与技术学院,南京210016 [2]南京航空航天大学机械结构力学及控制国家重点实验室,南京210016 [3]南京化工职业技术学院化学工程系,南京210048

出　　处：《机械工程材料》2016年第1期47-51,共5页Materials For Mechanical Engineering

基　　金：中央高校基本科研业务费专项资金资助项目(NZ2013307);南京航空航天大学基本科研业务费资助项目(NS2013060);江苏省博士后基金资助项目(1202016C)

摘　　要：采用磁控溅射技术制备了不同铜层厚度的ZnS/Cu/ZnS复合薄膜,并在不同温度（100~300℃）下对其进行退火处理,研究了铜层厚度和退火温度对复合薄膜物相、表面形貌、透光率和表面电阻等的影响。结果表明：随着铜层厚度增加,复合薄膜的表面粗糙度逐渐减小后趋于平缓,方块电阻逐渐下降;当铜层厚度为16nm时,复合薄膜的最高透光率最大为87%,方块电阻为62.5Ω;随着退火温度升高,复合薄膜中ZnS层结晶性增强,表面出现颗粒团簇;在100℃退火后,铜层厚度为16nm的复合薄膜的最高透光率为89%,方块电阻为46.3Ω。ZnS/Cu/ZnS composite film with different copper layer thicknesses were deposited by magnetron sputtering technology, and then was annealed at different temperatures （at the range of 100-300 ℃）. The effects of copper layer thickness on phase, surface morphology, optical transmittance and sheet resistance of the fihn were studied. The results show that, with the increase of copper layer thickness, roughness of composite film gradually decreased and trended to constant, and sheet resistance gradually decreased. When the thickness of copper layer was 16 nm, the peak optical transmittance was the highest, and the transmittance was 87% and sheet resistance was 62.5 %. With the increase of annealing temperature, the crystalline of ZnS layer improved, and particles cluster was observed. After annealing at 100 ℃ the composite film with copper layer thickness of 16 nm owned the maximum optical transmittance of 89% and the lowest resistance of 46.3 Ω.

关 键 词：ZnS/Cu/ZnS复合薄膜 退火温度 透光率 电阻 

分 类 号：TB34[一般工业技术—材料科学与工程]