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机构地区:[1]西安航空动力股份有限公司材料检测研究中心,西安710021
出 处:《理化检验(化学分册)》2016年第2期196-199,共4页Physical Testing and Chemical Analysis(Part B:Chemical Analysis)
摘 要:采用氟硼酸根离子选择电极法测定铜基焊料中硼元素的含量。样品用盐酸和硝酸溶解,冒烟1~2min后,加入氢氟酸在沸水浴中氟化5min。采用0.3mol·L-1 EDTA溶液作为络合剂,消除了基体及共存元素对测定的干扰。电极电位测定时溶液的pH为4.1,稳定时间为1h。电极响应平衡时间为2min。加标回收率在100%~101%之间,测定值的相对标准偏差(n=6)为4.9%。Ion-selective electrode of fluoroborate radical (BF4 ) was applied to the determination of boron in copper-based solders. The sample was dissolved in hydrochloric acid and nitric acid, and fumed for 1- 2 min. Hydrofluoric acid was added for fluorination in a boiling water bath for 5 min. 0. 3 mol · L 1 EDTA solution was added as complexant to eliminate the interferences of matrix and coexisting elements. Acidity of the solution was controlled at pH 4. 1 in the determination of electrode potential, and the stablization time found was 1 h. Equilibrium time of electrode response found was 2 rain. Values in the range of 100%-101%, and value of RSD found (n=6) of recovery found by standard addition method were was 4. 9 %.
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