机械镀Cu-Zn合金的研究  

Study on Mechanical Plating of Cu-Zn Alloy

作　　者：李继锋[1] 裴和中[1] 王胜民[1] 赵晓军[1] 

机构地区：[1]昆明理工大学材料科学与工程学院,云南昆明650093

出　　处：《电镀与环保》2016年第2期9-11,共3页Electroplating & Pollution Control

摘　　要：利用沉积促进剂制备了耐蚀性优良的机械镀Cu-Zn合金。采用正交试验优化了镀覆工艺参数,并通过分析镀层的外观、结合强度及形貌对其耐蚀机制进行了探讨。机械镀Cu-Zn合金的优化参数为:铜锌质量比2∶1,镀液pH值1.0,沉积促进剂10mL/L。Cu-Zn alloy with excellent corrosion resistance was prepared with deposition boosting agents. The plating process parameters were optimized by orthogonal test. Furthermore, the appearance, bonding strength and morphology of the alloy were analyzed, and the corrosion resistance mechanism was investigated. As the results, the optimized parameters for mechanical plating of Cu-Zn alloy coating were as follows：Cu-Zn mass ratio 2： 1, plating solution pH value 1.0, boosting agents 10 mL/L.

关 键 词：机械镀 CU-ZN合金 工艺 

分 类 号：TQ153[化学工程—电化学工业]