大功率LED封装基板技术与发展现状  

Technologies and Development Status of Heat Spreader for High-power LED Packaging

作　　者：吴朝晖 程浩[2] 章军 罗素扑 陈明祥[2] 

机构地区：[1]东莞市凯昶德电子科技股份有限公司,广东东莞523710 [2]华中科技大学机械科学与工程学院,武汉430074

出　　处：《半导体光电》2016年第1期1-6,12,共7页Semiconductor Optoelectronics

基　　金：东莞市产学研合作项目(2013509124211);材料复合新技术国家重点实验室(武汉理工大学)开放基金项目(2014-KF-11);华中科技大学国防自主创新基金项目

摘　　要：散热是大功率LED封装的关键技术之一,散热基板的选用直接影响到LED器件的使用性能与可靠性。文章详细介绍了LED封装基板的发展现状,对比分析了树脂基板、金属基板、陶瓷基板、硅基板的结构特点与性能。最后预测了今后大功率LED基板的发展趋势及需要解决的问题。Thermal management is one of key technologies of high-power LED packaging,and heat spreader will directly affect the performance and reliability of LED devices.In this work,the status and development of heat spreaders for LED packaging was introduced.Some heat spreaders including resin substrates, metal substrates,ceramic substrates and silicon substrates were compared in the structural characteristics,thermal conductivity and packaging applications.Moreover,the development trend and problems to be solved of packaging substrates for LED were pointed out.

关 键 词：功率型LED 封装基板 散热 光引擎 

分 类 号：TN252[电子电信—物理电子学]