双辊甩带制备Au-20%Sn焊料及其均匀化退火工艺  

Au-20%Sn solder prepared by twin-roll method and its homogenized annealing

作　　者：刘锐[1] 王日初[1] 韦小凤[1] 彭健[1] 

机构地区：[1]中南大学材料科学与工程学院,湖南长沙410083

出　　处：《中南大学学报（自然科学版）》2015年第11期4021-4027,共7页Journal of Central South University:Science and Technology

基　　金：国家军品配套项目(JPPT-125-GH-039)~~

摘　　要：采用双辊甩带技术制备Au-20%Sn焊料薄带材,观察和分析快速凝固Au-20%Sn焊料薄带的显微组织以及熔融特性,并研究合金的均匀化退火工艺。研究结果表明:双辊甩带合金由ζ′(An5Sn)和δ(Au Sn)两相组成,显微组织细小。合金的熔化温度接近共晶点,满足焊料的熔点要求。均匀化退火过程中,δ(Au Sn)相逐渐长大,合金的硬度降低。根据薄带的组织和硬度,确定均匀化退火工艺为260℃下退火4 h。Au-20%Sn solder strips were prepared by twin-roll method. The microstructure of the solders was observed and melting behaviors were analyzed, homogenized annealing technology was also studied. The results show that the strips prepared by twin-roll method are composed of two phases, which are siginificantly refined ζ （AnsSn） and δ（AuSn） phases. The melting temperature of the alloy is close to the eutectic temperature, which can meet the requirements of Au-20%Sn solders. During the homogenized annealing,δ（AuSn） phase grows gradually and the hardness of the alloy decreases. According to the microstructure and the hardness of strips, the optimal treatment is annealed at 260 ℃ for 4 h.

关 键 词：双辊法 金锡焊料 均匀化退火 

分 类 号：TG162.83[金属学及工艺—热处理]