热处理对直接镀Pd键合Cu线性能的影响  

Effect of annealing on properties of direct-coated Pd copper bonding wire

作　　者：曹军[1] 范俊玲[2] 高文斌[1] 刘志强[1] 

机构地区：[1]河南理工大学机械与动力工程学院,河南焦作454000 [2]焦作大学化工与环境工程学院,河南焦作454003

出　　处：《材料热处理学报》2016年第3期171-175,共5页Transactions of Materials and Heat Treatment

基　　金：博士基金项目(60407/004)

摘　　要：利用扫描电镜、透射电镜、聚焦离子束、强度测试仪研究了键合Cu线无卤直接镀Pd工艺及镀Pd键合Cu线性能,分析了热处理温度对直接镀Pd键合Cu线钯层界面结合强度、镀Pd键合Cu线拉断力、伸长率及钯层厚度的影响。结果表明:无卤直接镀Pd工艺可获得镀层均匀的镀Pd键合Cu线;随热处理温度增加,钯层结合强度增加,热处理温度300℃时,镀层与基体结合强度较低;热处理温度450℃时,直接镀Pd键合Cu线钯层与基体Cu之间产生了Pd3Cu5金属间化合物,钯层与铜线基体结合强度较好;热处理温度450℃时,直接镀钯铜线具有优良的力学性能适当的钯层厚度,镀Pd键合Cu线拉断力为0.096 N,伸长率为14.3%,钯层厚度为78 nm;热处理温度500℃时镀Pd键合Cu线晶粒粗大,力学性能降低,拉断力为0.073 N,伸长率为11.6%。The directed coating Pd technology and coated Pd copper bonding wire were investigated by scan electronic microscopy,transmission electron microscope,focused ion beam and tensile strength tester,the effects of annealing temperature on Pd binding strength,wire tensile strength,elongation and Pd thickness of the direct coated Pd copper bonding wire were analyzed. The results show that Pd thickness is uniform after direct coating Pd. The bonding strength can increase when annealing temperature increases,and the binding strength is lower after annealing at 300 ℃,and some Pd3Cu5 can be found between Pd and Cu interface after annealing at 450 ℃,then the binding strength can meet the industrial demand. The tensile strength can decrease when annealing temperature increases,while the elongation can increase. When annealing temperature reaches 450 ℃,the Pd coated copper wire has excellent mechanical properties,and the tensile strength is 0. 096 N,elongation is 14. 3%,the Pd thickness is 78 nm. When annealing temperature reaches 500 ℃,the mechanical properties of Pd coated copper bonding wire decrease,and tensile strength is 0. 073 N,and elongation is 11. 6%.

关 键 词：直接镀钯 热处理 结合强度 Pd厚度 力学性能 

分 类 号：TQ153.1[化学工程—电化学工业]