废弃印刷电路板焊锡离心分离过程的试验研究  

Experimental Study on the Centrifugal Separation Process of the Solder on the Waste Printed Circuit Boards

作　　者：周先桃[1] 王瑞雄[1] 缪晓芳[1] 王武生[1] 

机构地区：[1]华东理工大学化工机械研究所,上海200237

出　　处：《安全与环境工程》2016年第2期33-38,共6页Safety and Environmental Engineering

摘　　要：电子废弃物的快速增加,已带来了巨大的环境问题。废弃印刷电路板作为电子废弃物的核心组件,是电子废弃物中最难处理的部分。提出了一种废弃印刷电路板焊锡的热熔离心分离回收方法及其装置。从理论上分析了印刷电路板离心分离过程中焊点脱焊不完全的问题,提出了临界分离半径的概念,并通过试验研究了旋转时间、加热温度和转速对临界分离半径的影响。试验结果表明:旋转时间超过60s后,临界分离半径的大小与旋转时间无关;加热温度或者转速的增加都会导致临界分离半径的减小。最后拟合得出了不同操作条件下印刷电路板焊锡脱离的临界分离半径,解决了印刷电路板离心分离过程中焊点脱焊不完全的问题,对新工艺装备的推广应用具有指导意义。The rapid increasing of electronic waste sites has brought big environmental problems.As the core component of the electronic waste,the printed circuit boards（PCBs）are the most difficult part to deal with.This paper proposes a new technology and device to separate and recycle the solder from the waste PCBs.The paper theoretically analyzes the problem that the solder cannot be separated completely from the PCBs during the centrifugal separation process,puts forward the concept of the critical separation radius,and studies the influence of the rotation time,heating temperature and rotational speed on the critical separation radius through experiments.The results show that the size of the critical separation radius is irrelevant to the rotation time when the rotation time exceeds 60 seconds,and the size of the critical separation radius decreases with the increasing of the temperature or the rotational speed.In the end,the critical separation radius of the PCBs under different operating conditions is fitted.The paper proposes the method which can solve the problem that the solder cannot be separated completely from the PCBs during the centrifugal separation process,which has guidance significance to the application of new technology and equipment.

关 键 词：废弃印刷电路板 拆卸 焊锡 离心分离 临界分离半径 

分 类 号：X76[环境科学与工程—环境工程]