Mo/Cu扩散焊接头组织性能研究  

Investigation on Microstructure and Mechanical Performance of Diffusion Bonding Joint Composite with Mo/Cu

作　　者：成军[1] 赵云涛[1] 邹军涛[1] 刘金锋[1] 

机构地区：[1]西安理工大学材料科学与工程学院,陕西西安710048

出　　处：《热加工工艺》2016年第5期190-191,195,共3页Hot Working Technology

基　　金：教育部高等学校特色专业建设点项目(TS12493);陕西省协同创新计划项目(2015XT-16)

摘　　要：应用固态扩散焊方法制备出钼/铜(Mo/Cu)复合棒接头,利用金相显微镜、扫描电镜和显微硬度计、拉伸压剪分离等试验手段分析了复合界面的组织特征及力学性能。结果表明:在Mo/Cu物理界面两端形成了数十微米宽的扩散层,扩散层的显微硬度值高于铜棒的硬度值而小于钼棒硬度值;结合界面的抗拉强度相当于Cu基体强度的40%;结合界面的剪切强度与Cu基体剪切强度相当,可以满足以剪切强度为承载方式的性能要求。The Mo/Cu composite rod was prepared with solid diffusion bonding technique. The microstructure and mechanical performance of the composite interface were investigated by means of optical microscope, scan electron microscope, energy spectrum analysis, shear strength tests and micro hardness measuring techniques. The results show that diffusion bonding transition layer with tens of microns formed at two ends of the interface of Mo/Cu rod, the hardness of the transition layer is higher than that of copper matrix, but it is lower than that of molybdenum.The tensile strength of the bonding interface is equivalent to 40% of the Cu matrix. The shear strength of the interface is equivalent to the shear strength of Cu matrix. The performance requirements can be met with the shear strength as the bearing capacity.

关 键 词：Mo/Cu复合棒 扩散层 剪切强度 

分 类 号：TG456[金属学及工艺—焊接]