铜基低温化学镀镍工艺因素对结合力的影响研究  

Effects of bonding strength by technological parameters of electroless nickel plating on copper matrix at low temperature

作　　者：侯俊英[1] 高洪江[1] 刘肖林[1] 白杨[1] 

机构地区：[1]青岛科技大学,山东青岛266061

出　　处：《中国铸造装备与技术》2016年第2期9-12,共4页China Foundry Machinery & Technology

摘　　要：在外加磁场的条件下对影响铜基体化学镀镍工艺的因素进行实验分析,结果表明,随着主盐浓度比的变化、施镀温度的改变以及外加磁场的不同,化学镀镍镀层的形貌、镀层与基体的结合力有所改变。其中化学镀液中主盐的浓度比对镀层与基体的结合强度影响最小,但对镀层中镍磷的含量影响较大。温度对镀层的形貌及镀层与基体的结合强度有明显影响,在40℃时结合力最好,温度越高结合力下降。随着外加磁场强度的增加镀层与基体的结合强度也随之增大。In addition of magnetic field, the influence factors of the copper matrix electroless plating technology have explored. The results showed that with the ratio change of the main salt concentration, the temperature and the strength of external magnetic field, the morphology of electroless plating layer and bonding force between coating and the substrate changes. The main salt concentration ratio of the plating solution has a minimum influence to the bonding strength between coating and the substrate, but the phosphorus content of the coating has large influence. Temperature has significant effect on the morphology of the film and on the coating bonding strength between coating and substrate. When it is 40 C the bonding force is best ,and the higher the temperature the lower of the bonding force. On the other hand, with the increase of the strength of external magnetic field, the bonding strength between coating and the substrate also increase.

关 键 词：外加磁场 结合强度 表面形貌 铜基材料 

分 类 号：TG174.4[金属学及工艺—金属表面处理]