大功率IGBT用耐高温环氧灌封胶的研制  

Preparation of High Temperature Resistance Epoxy Pouring Sealant for High-power IGBT

作　　者：曾亮[1] 黎超华 李忠良[1] 李鸿岩[1] 姜其斌[1] 

机构地区：[1]株洲时代新材料科技股份有限公司,湖南株洲412007

出　　处：《绝缘材料》2016年第3期24-28,共5页Insulating Materials

摘　　要：以AG-70、TDE-85、ZTE-140耐高温环氧树脂为基础,使用桐油酸酐与三(2-羟乙基)异氰脲酸酯为原料合成的赛克-桐油酸酐(TTOA)为固化剂,添加活性稀释剂、环氧增韧剂、氧化铝(Al2O3)和碳化硅(Si C)填料等,制备了耐高温环氧电子灌封胶,筛选出最合适的耐高温环氧树脂体系配方。结果表明:经过配方优化后的耐高温环氧胶力学性能良好,介电性能优良,可以满足大功率IGBT模块的封装使用要求。Using high temperature resistance epoxy resin AG-70, TDE-85, ZTE-1470 as matrix, the THEIC-tung oil anhydride（TTOA） synthesized from tung oil anhydride and tri（2-hydroxyethyl）isocyanurate（THEIC） as curing agent, a high temperature resistance epoxy pouring sealant was prepared by adding reactive diluent, epoxy flexibilizer, aluminum oxide and silicon carbide fillers. The most suitable formula of high temperature resistance epoxy resin system was determined. The results show that the epoxy pouring sealant after optimizing formula has good mechanical properties and dielectrical properties,which can meet the embedment requiements of high power IGBT module.

关 键 词：大功率IGBT 耐高温环氧树脂 灌封胶 无机填料 

分 类 号：TM215[一般工业技术—材料科学与工程] TQ436[电气工程—电工理论与新技术]