硅橡胶包覆层对传统环氧树脂灌封工艺的优化  

Optimization of the traditional epoxy encapsulation process by silicone rubber coating layer

作　　者：朱棣[1] 洪彬[1] 吕顺雅 胡菊 王红美 

机构地区：[1]天津大学内燃机研究所,天津300072 [2]天津市天波科达科技有限公司,天津300034

出　　处：《热固性树脂》2016年第2期41-44,共4页Thermosetting Resin

摘　　要：采用真空灌封工艺在元器件表面包覆硅橡胶后再进行环氧树脂灌封。通过局部放电测试、高低温实验以及残余应力测试等研究了硅橡胶包覆层的引入对环氧灌封体性能的影响。结果表明:与传统灌封工艺相比,真空灌封工艺可有效减少灌封体内缺陷,提高灌封元器件的电性能和力学性能。同时,硅橡胶包覆层的引入使灌封体的力学性能进一步得到改善,优化了环氧树脂灌封元件工艺。The components were encapsulatated with epoxy resin after the surface coated with silicone rubber by vacuum encapsulation process. The effect of silicone rubber coated layer on the properties of epoxy encapsulated components were investigated by the partial discharge test,high-low temperature tests and residual stress tests. The results showed that compared with the traditional encapsulation process,the vacuum encapsulation process could be effective in reducing encapsulated body defects and improve the electrical and mechanical properties of encapsulated components. Meanwhile, the mechanical properties of the encapsulated components were further improved by the introduction of the silicone rubber coating layer and the epoxy encapsulation process was optimized.

关 键 词：真空灌封 硅橡胶包覆层 环氧树脂 残余应力 电性能 力学性能 

分 类 号：TQ323.5[化学工程—合成树脂塑料工业]