固体界面热整流现象的解析  

Analysis of the Heat Rectification Phenomenon of Solid Interface

作　　者：张九如[1] 金燕[2] 

机构地区：[1]江苏大学理学院,江苏镇江212013 [2]清华大学热能工程系,北京100084

出　　处：《材料科学与工程》2002年第3期432-434,共3页Materials Science and Engineering

摘　　要：两种不同固体材料相互接触所形成的接触面的热传导与热流的方向有关 ,这种现象称为热整流现象。本文从线性应答理论推导出的固体接触界面的热传导系数计算公式表明 ,热传导系数与温度成正比。分析表明 ,当两种材料热传导系数不同时 ,接触面产生热整流现象 ,并且能量传导系数越大 。The heat conducting of the interface of two different kinds of solid materials has something to do with the direction of thermal current. Such a phenomenon is called heat rectification. Based on the theory of linear answering, this thesis has deduced the formula of calculating the heat conducting coefficient of solid interface, which shows that the coefficient is in direct proportion to the atmosphere. That is, when two solid materials with different heat conducting coefficients meet, the heat rectification phenomenon of their interface will arise. The bigger the coefficient is, the more obvious the heat rectification phenomenon is.

关 键 词：固体界面 热整流现象 热传导系数 接触界面 线性应管理论 热流 

分 类 号：TK124[动力工程及工程热物理—工程热物理]