核壳结构PMMA/CeO_2复合磨料对氧化硅片的抛光特性  

Polishing Performance for Oxidized Silicon Wafer of the Core-Shell Structured PMMA/CeO_2 Composite Abrasives

作　　者：陈杨[1] 赵晓兵[1] 李霞章[1] 付猛[1] 陆晓旺[1] 

机构地区：[1]常州大学材料科学与工程学院,江苏常州213164

出　　处：《常州大学学报（自然科学版）》2016年第2期8-13,共6页Journal of Changzhou University：Natural Science Edition

基　　金：国家自然科学基金资助项目(51205032;51405038;51575058)

摘　　要：磨料的种类和性质对抛光质量具有重要影响,核壳结构有机/无机复合磨料的可控制备为实现无损伤抛光提供了有益思路。本实验利用基于正负电荷间静电作用的化学原位包覆技术,设计合成了具有可控无机壳层包覆量的PMMA/CeO2复合磨料,借助红外、扫描电镜、透射电镜和热重分析等手段对样品进行表征。借助原子力显微镜分析抛光试验前后热氧化硅片衬底表面的微观形貌、粗糙度和轮廓曲线,探索了复合磨料的CeO2壳层包覆量对抛光性能的影响。电镜结果显示,复合磨料呈单分散规则球形,CeO2纳米颗粒均匀包覆在PMMA内核（280~300nm）表面;热重分析表明,本实验所得复合磨料样品中的CeO2壳层质量分数在40%~56%。抛光试验结果显示,复合磨料的CeO2包覆量对抛光衬底表面质量有明显影响,当CeO2纳米颗粒在PMMA内核表面呈单层包覆时（样品C2）,可获得无损伤的超光滑加工表面,抛光后表面粗糙度（Ra）平均值由0.63±0.07nm降至0.25±0.01nm,粗糙度均方根值（RMS）由0.79±0.08nm降至0.31±0.02nm。The properties of abrasive particles play a key role in chemical mechanical polishing（CMP）process.The structural design of core-shell structured organic/inorganic composite abrasives provides a helpful solution to obtain damage-free surfaces.In this work,the polymethylmethacrylate coated ceria（PMMA/CeO2）with controlled coating amounts were synthesized viaan in-situ chemical precipitation technique based on electrostatic interaction.The as-prepared samples were characterized by Fourier transform infrared spectrometer（FT-IR）,field emission scanning electron microscopy（FESEM）,transmission electron microscopy（TEM）,and thermogravimetric analysis（TGA）.The topography,roughness and profile curve of the oxidized silicon substrate before and after polishing were characterized by atomic force microscopy.The effect of ceria coating amounts of the PMMA/CeO2 composites on polishing behavior was investigated.FESEM and TEM results show that the composite particles are spherical in shape,and the ceria nanoparticles are uniformly located on the surfaces of PMMA cores（280-300nm）.TGA results indicate that the ceria mass content in the composites range from 40%to 46%.CMP test results indicate that there is an obvious effect of ceria coating amounts of the composites on polishing behavior.An ultra-smooth and damage-free surface is achieved using the composites C2,in which CeO2 nanoparticles are monolayer-coated on the PMMA cores.The average（Ra）and root mean square（RMS）roughness of the wafers is reduced from 0.63±0.07 nm and 0.79±0.08 nm to 0.25±0.01 nm and 0.31±0.02 nm,respectively.

关 键 词：聚甲基丙烯酸甲酯 氧化铈 核壳结构 复合颗粒 磨料 抛光 

分 类 号：TB383[一般工业技术—材料科学与工程]