固态发射机末级组件热设计  

Thermal design of final module in solid state transmitter

作　　者：任恒[1] 关宏山[1] 彭伟[1] 

机构地区：[1]中国电子科技集团公司第三十八研究所

出　　处：《制冷与空调》2016年第3期17-20,25,共5页Refrigeration and Air-Conditioning

摘　　要：固态发射机末级组件内功率器件的散热对加速器的性能和可靠性有重要影响。针对末级组件热耗高、热流密度大的特点,采用强迫液冷的冷却方式实现对组件内功率器件温度的有效控制。通过热仿真软件Icepak进一步研究冷板内流道并联和串联两种设计方式对功率器件温度的影响,为此类组件热设计、热仿真问题的工程应用提供参考。The power device cooling of the final module in solid state transmitter has important effects on the performance and reliability of the accelerator. Aimed at high power of final module with high heat density,the liquid forced cooling method is used,which can effectively control the temperature of the main power device in the final module. Furthermore,the effects of parallel and series connections of liquid flow passages on the temperature of the main power device are investigated using CFD software Icepak,which provide references for the thermal design and simulation of this type of module in engineering application.

关 键 词：末级组件 高热流密度 液冷冷板 热设计 

分 类 号：TN834[电子电信—信息与通信工程]