玻璃封接组件表面处理工艺难点探讨  

Discussion on difficulties in surface treatment process of glass sealed components

作　　者：江洪涛[1] 宋路路[1] 徐玉娟[1] 

机构地区：[1]中国电子科技集团公司第四十研究所,安徽蚌埠233010

出　　处：《电镀与涂饰》2016年第5期256-261,共6页Electroplating & Finishing

摘　　要：探讨了玻璃封接组件挂镀时引线的导电,多种材料组合体的抛光,局部电镀时产生的置换,电镀后绝缘电阻不稳定等难题,对具体的表面处理工艺进行了总结。Some difficulties in surface treatment of glass sealed components were discussed, such as electrical conduction of leads, polishing of the components made of several different materials, replacement reaction occurring during partial electroplating, and instability of insulation resistance after electroplating. The corresponding surface treatment processes were summarized.

关 键 词：玻璃封接组件 去氧化皮 抛光 绝缘 局部电镀 

分 类 号：TQ153[化学工程—电化学工业]