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机构地区:[1]深圳市柳鑫实业股份有限公司,广东深圳518000
出 处:《印制电路信息》2016年第A01期27-33,共7页Printed Circuit Information
摘 要:文章介绍了PCB背钻工艺专用单面覆铝箔盖板的结构形态及生产制作流程。对其树脂材料进行钻孔粉屑,钻削温度、钻削轴向力研究,用扫描电镜SEM分析材料钻孔粉屑形态,用红外测温设备检验钻削温度状况,用钻削轴向力测试设备测量钻削力情况。进一步对盖板进行钻孔性能应用研究,包括钻针残屑、钻针磨损、孔位精度、控深精度、孔壁粗糙度、钉头、披锋。旨在探索单面覆铝箔盖板搭配PCB背钻工艺钻孔应用效果。This paper introduced the structure and manufacturing and the production processes of the single side covered aluminum entry board which was used in backplane drilling process as a high-precisio,1 entry board. The drilling chip, drilling temperature and drilling force of the resin material were also studied using SEM, Infrared Thermometer and drilling force testing equipment. Besides the drilling application research inch, ding bur remaining chips, bur wear, hole position accuracy, depth control accuracy, hole wall roughness, nailhead, burr were further studied .It aimed to explore the effects of drilling applications on the sided covered aluminum entry board with the backplane drilling process.
分 类 号:TN41[电子电信—微电子学与固体电子学]
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